Laptop Cooling System: incorrect thermal interface material. The wrong pad, compound or thickness prevents even contact between a hot component and its cooler.

The distinguishing clue

One component overheats after a prior repair while airflow remains normal.

Checks before an assessment

Use the laptop on a firm surface with its vents unobstructed. Record whether exhaust airflow and fan noise change during normal work; stop after a thermal shutdown.

Stop point: Do not run heavy workloads when the fan is stopped or exhaust air is absent.

Workshop confirmation and repair

Device-level check: Record fan speed, temperature and workload, then inspect the complete air path and mounting.

Targeted check: Compare interface type, coverage and thickness with service information. If confirmed: Fit the correct compound or pad without stacking random materials.

Repair boundary: Repair the confirmed fan, heatsink, pad, compound or control fault as one cooling path.

Related cause to rule out

When temperature rises almost immediately under modest load, also consider Laptop Cooling System: poor heatsink contact before choosing a repair.

Checks after the work

After repair or replacement, check idle, processor load, fan response, sleep and cooldown.

For an AEPC repair assessment in East Auckland, provide the exact model and observed clue. Call 027 908 8880 before visiting the Burswood workshop.