Desktop CPU Cooling System: incorrect thermal interface material. The wrong pad, compound or thickness prevents even contact between a hot component and its cooler.

The distinguishing clue

One component overheats after a prior repair while airflow remains normal.

Checks before an assessment

Note whether temperature rises quickly after startup or only under sustained CPU work. Keep the case closed and avoid load tests if the cooler may be loose or the pump has stopped.

Stop point: A loose cooler can allow unsafe temperature rise within seconds.

Workshop confirmation and repair

Device-level check: Compare pump or fan speed, cooler mounting, case airflow and processor power under a controlled test.

Targeted check: Compare interface type, coverage and thickness with service information. If confirmed: Fit the correct compound or pad without stacking random materials.

Repair boundary: Repair the confirmed fan, pump, mounting, compound or airflow fault before extended load.

Related cause to rule out

When temperature rises almost immediately under modest load, also consider Desktop CPU Cooling System: poor heatsink contact before choosing a repair.

Checks after the work

After repair or replacement, check idle, processor stress, fan or pump speed and cooldown.

For an AEPC repair assessment in East Auckland, provide the exact model and observed clue. Call 027 908 8880 before visiting the Burswood workshop.